1.5W/m.K Thermally Conductive Encapsulants & Pottings for Electronics

Flame Retardant Silicone Potting Adhesive SI8230

∎Product Description

●SI8230 is two-component silicone based thermal conductive potting adhesive. It has a good fluidity after mixing, can vulcanize to deep layer in room temperature. The operation time can be adjusted according to the temperature. Used to potting protection of varied heat dissipation and temperature resistance components. Fully compliant with RoHS and SVHC REACH standard.

∎Application

●Used for encapsulation of various modules, automotive module, LED Power driver modules, Solar panel junction box, EV charging column module, Lithium battery pack, Capacitor banks, Magnetic induction coils, Power inverters, etc.

∎Technical Data Table

TESTING ITEM ESTING STANDARD Part A Part B
Color Visual inspection White / black viscous liquid White viscous liquid

Viscosity, cps , 25℃   GB/T 10247-2008   2500±500   2300±500
Density,,g/cm3, 25℃   GB/T 15223-1994   1.63±0.05   1.63±0.05
Mixture ratio   Weight Ratio   A：B = 100：100
Viscosity of mixture,4#rotor,cps , 25℃   GB/T 10247-2008   2500±500
Operation time,mins , 25℃   GB/T 10247-2008   50±10
Tack free, mins, 25℃   GB/T 10247-2008   90±20
Cure condition   GB/T 10247-2008   25℃/3-5 hr or 80℃/ 30mins
Characteristics after curing
Cured appearance   Visual inspection   Gray, white or black elastomer
Hardness, Shore A   GB/T 531-2008   55±5
Thermal conductivity，W/mK   GB/T 10297-1998   1.5
Linear expansion，K-1，ppm   HGT 2625-1994   230
Dielectric strength ,kV/mm, 25℃   GB/T 1695-2005   ≥15
Volume resistance,DC 500V， Ω·CM   GB/T 1692-92   1.1×1014
Loss factor(1 MHz)   GB/T 1693-2007   0.009
Dielectric constant(1 MHz)   GB/T 1693-2007   3.00
Application temperature, ℃   GBT 20028-2005   - 50 ∽ 250
Flame resistance   UL-94   V-0

1.5W/m.K Thermally Conductive Encapsulants & Pottings for Electronics

$4.80

Color

SI8230 is used for Used for encapsulation of various modules, automotive module, LED Power driver (optional)

Quantity

For the orders, normally we do shipping by sea.

For the samples, we will ship by air through Fedex, UPS or DHL.

Any inquiry, please contact us directly by email or whatsapp, please don't place the order, we need to evaluate the shipping way and freight, thanks a lot.
Part A：25 kg/plastic drum

Part B：25 kg/plastic drum

Part A：250 kg/plastic drum

Plat B：250 kg/plastic drum
Mixing uniformity in the packing before using, as there’s part of filler sedimentation happens during storage.

Mix Part A and Part B by 1:1 mass ratio, after evenly mixed, pouring directly into the components or modules as per requirements. It’s recommended to slowly pour along the walls of the implements, so as to reduce the bubbles happens.

Still the potted component to let out the bubbles. Can be cured by heat, about 30 minutes in 80°C. If cured under room temperature, about 4 hours.

Vacuum defoaming can improve the performance of cured product.

Seal the remaining products tightly after use.

Low temperature will slow the curing speed, overheating will lead to curing speed too fast. Keep the constant temperature in workshop is recommended.

It's hard for SI8230 to cure if contact with sulfur, amine, organotin and unsaturated hydrocarbon plasticizer. Common substances like rosin, natural rubber. For these should do test before application.
∎Key Features

Two-part 1:1 mixture addition type silicone adhesive

Low hardening shrinkage

Excellent electrical insulation in high temperature and stability

Good waterproof and moisture resistance

Excellent flame resistance

Applications	LED modules \Lamps	PV modules/Junction box	Automobile / Power modules
Operation time，min	50	25	45
Curing time，hour	5	L2.5	5

1.5W/m.K Thermally Conductive Encapsulants & Pottings for Electronics

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Packing Specification

∎Transport &Storage

.∎Directions for Use

Typical Applications

∎Key Features

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