Encapsulation and Potting Electronics with Silicone Solutions
 
∎Product Description
SI8230-1 is a two-component silicone based thermal conductive potting adhesive. It has a good fluidity after mixing, can vulcanize to a deep layer in room temperature. The operation time can be adjusted according to the temperature. Used to potting protection of varied heat dissipation and temperature resistance components. Fully compliant with RoHS and SVHC REACH standards.
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∎Typical Applications
●Used for encapsulation of various modules, automotive module, LED Power driver modules, Solar panel junction box, EV charging column module, Lithium battery pack, Capacitor banks, Magnetic induction coils, Power inverters, etc.
 
∎Key Features
 
Two-part 1:1 mixture addition type silicone adhesive
Low hardening shrinkage
Excellent electrical insulation in high temperature and stability
Good waterproof and moisture resistance 
Excellent flame-resistance, UL No: E340199
 
∎Packing Specification
●SI8230-1, Drak Gray Silicone Potting SealantPart A 25kg/Drum
 
∎Transport &Storage
● When stored at or below 35°C in the original unopened containers, this product has a usable life of 12 months from the date of production. Sampling test is necessary for products which exceed shelf life before taking use. During storage may have little settlement stratification, stirring evenly when use, does not affect performance.
It’s non-dangerous goods, can be transported as normal chemicals, CAUTION leakage during transport.
 
.∎Directions for Use
Mixing uniformity in the packing before using, as there’s part of filler sedimentation happens during storage.
Mix Part A and Part B by 1:1 mass ratio, after evenly mixed, pouring directly into the components or modules as per requirements. It’s recommended to slowly pour along the walls of the implements, so as to reduce the bubbles happens.
Still the potted component to let out the bubbles. Can be cured by heat, about 30 minutes in 80°C. If cured under room temperature, about 4 hours.
Vacuum defoaming can improve the performance of the cured products.
Seal the remaining products tightly after use.
Low temperature will slow the curing speed, overheating will lead to curing speed too fast. Keep a constant temperature in the workshop is recommended.
It's hard for SI8230-1 to cure if contact with sulfur, amine, organotin and unsaturated hydrocarbon plasticizer. Common substances like rosin, natural rubber. For these should do test before application.