High Temperature Thermally Conductive Two Component Epoxy Potting Compound Sealant Ep6113
∎Product Description
Ep6113 is is a two-component solventless, room temperature curing epoxy potting material for automotive, automotive electronics, power tools, reactors, instruments with high thermal conductivity requirements of the product package protection, and has excellent adhesion and heat resistance.
∎Application
●For encapsulation of electric products which require high thermal conductivity and heat resistance, such as motors, electric reactor, electric tools, instrumentation, automotive electronics etc.
∎Technical Data Table
PROPERTY STANDARD/UNITS VALUE of Ep6113---- ---- PART A PART B
Appearance Visual inspection Black fluid Transparent liquid
Viscosity 25°C, cps 20,000±3,000 25
Density 25°C, g/cm3 2.35±0.05 0.93±0.05
Mixture ratio Mass ratio A:B=100:8
Viscosity of mixture 25°C, cps 2,000±300
Density of Mixture 25°C, g/cm3 1.1~1.13
Operation time 25°C, min 40
Preliminary Cured 60°C, min 60
Hardness Shore D 90
Thermal conductivity W/mK 1.3
Expansion coefficient μm/(m, °C) 20
Glass transition temperature DSC, °C 95
Shear strength MPa, Fe/FeMPa, Al/Al ≥8≥8
Dielectric strength kV/mm, 25°C ≥18
Loss factor （1MHz）(25℃) 0.09
Dielectric constant 1MHz, 25°C 2.9
Volume resistance DC500V, ohm-cm 1.00E +15
Application temperature °C -50~180
Thermally Conductive Epoxy Potting Compound Sealant
For the orders, normally we do shipping by sea.
For the samples, we will ship by air through Fedex, UPS or DHL.
Any inquiry, please contact us directly by email or whatsapp, please don't place the order, we need to evaluate the shipping way and freight, thanks a lot.