Thermally Conductive Silicone Adhesives for Electronics SI8230ZN
∎Product Description
SI8230ZN is a two-component silicone based thermal conductive potting adhesive. It has a good fluidity after mixing, can vulcanize to a deep layer in room temperature. The operation time can be adjusted according to the temperature. Used to potting protection of varied heat dissipation and temperature resistance components. Fully compliant with RoHS and SVHC REACH standards.
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∎Typical Applications
●Used for encapsulation of various modules, automotive module, LED Power driver modules, Solar panel junction box, EV charging column module, Lithium battery pack, Capacitor banks, Magnetic induction coils, Power inverters, etc.
∎Key Features
- Two-part 1:1 mixture addition type silicone adhesive
- Low hardening shrinkage
- Excellent electrical insulation in high temperature and stability
- Good waterproof and moisture resistance
- Excellent flame resistance, UL No: E340199
∎Packing Specification
●●SI8230ZN,Gray Silicone Potting SealantProduct code: Part A, 0104014,25kg/DrumPart B, 0105015,25kg/Drum
∎Transport &Storage
● When stored at or below 35°C in the original unopened containers, this product has a usable life of 12 months from the date of production. Sampling test is necessary for products which exceed shelf life before taking use. During storage may have little settlement stratification, stirring evenly when use, does not affect performance.
It’s non-dangerous goods, can be transported as normal chemicals, CAUTION leakage during transport.
.∎Directions for Use
Mixing uniformity in the packing before using, as there’s part of filler sedimentation happens during storage.
Mix Part A and Part B by 1:1 mass ratio, after evenly mixed, pouring directly into the components or modules as per requirements. It’s recommended to slowly pour along the walls of the implements, so as to reduce the bubbles happens.
Still the potted component to let out the bubbles. Can be cured by heat, about 30 minutes in 80°C. If cured under room temperature, about 4 hours.
- Vacuum defoaming can improve the performance of the cured products.
- Seal the remaining products tightly after use.
- Low temperature will slow the curing speed, overheating will lead to curing speed too fast. Keep a constant temperature in the workshop is recommended.
- It's hard for SI8230-1 to cure if contact with sulfur, amine, organotin and unsaturated hydrocarbon plasticizer. Common substances like rosin, natural rubber. For these should do test before application.
Thermally Conductive Silicone Adhesives for Electronics
TESTING ITEM
ESTING STANDARD
Part A
Part B
Color
Visual inspection
Black viscous liquid
White viscous liquid
Viscosity, cps , 25℃
GB/T 10247-2008
3500±1000
3500±1000
Density,,g/cm3, 25℃
GB/T 15223-1994
1.63±0.05
1.63±0.05
Mixture ratio
Weight Ratio
A:B = 100:100
Viscosity of mixture,4#rotor,cps , 25℃
GB/T 10247-2008
3500±1000
Operation time,mins , 25℃
GB/T 10247-2008
40±10
Cure condition
GB/T 10247-2008
25℃/8 hr or 70℃/ 50mins, 80℃/ 30mins
Characteristics after curing
Cured appearance
Visual inspection
Gray elastomer
Hardness, Shore A
GB/T 531-2008
50±5
Thermal conductivity,W/mK
GB/T 10297-1998
1.20
Linear expansion,K-1,ppm
HGT 2625-1994
170
Dielectric strength ,kV/mm, 25℃
GB/T 1695-2005
≥18
Volume resistance,DC 500V, Ω·CM
GB/T 1692-92
1.1×1014
Loss factor(1 MHz)
GB/T 1693-2007
0.01
Dielectric constant(1 MHz)
GB/T 1693-2007
3.00
Application temperature, ℃
GBT 20028-2005
- 60 ∽ 250
Flame resistance
UL-94
0